YAMAHA Total Line Solution for your Intelligent Factory
Maximize line productivity & factory efficiency
YSP10 : Compact High-end screen printing machine
L'YSP10 succède à l'YSP, une machine de sérigraphie haut de gamme dotée de têtes 3S et d'un mécanisme d'aspiration des pochoirs en standard.
The design and structure of the YSP10 have been thoroughly overhauled to allow complete automation of production changing tasks.
The YSP10 equipment can be equipped with an automatic stencil changing system as well as a solder paste transfer and automatic pin placement support system. It accepts standard 510 x 510 mm PCB’s and optional 610 mm x 510 mm.
YCP10 : high-performance compact printer
Printing quality similar to flagship models thanks to it automaticaly adjusts squeegee angle (3S Swing Single Squeegee) and its stencil clamping enhanced by vacuum.
Make detailed print inspections with a dedicated inspection camera offering a wide field of view and excellent resolution.
Handle large PCB's L 510 mm x W 460 mm
YSi SP : inspection machine SPI 3D
Solder paste inspection SPI in 3D.
The machine is able to inspect in 3D solder paste printed on you electronic PCB's.
A closed loop system with the printer machine allows to correct the possible printing offset and to order an automatic stencil cleaning action in case the stencil has blocked apertures. The equipment can combine 2D and 3D inspection.
YSM20 : High-efficiency modular pick & place machine
Modular thanks to its configuration with one or two beams, world's fastest in its class (up to 90,000 components / hour).
The HM high-speed multi-purpose head (10 nozzles) is made for high-speed mounting and versatility supports from ultra-tiny chips of 0.3 mm x 0.15 mm to large-size components of 45 mm x 100 mm and height of 15 mm.
The FM flexible multi-purpose head (5 nozzles) handles components from ultra-tiny chips of 0.3 mm x 0.15 mm to ultra-large components of 55 mm x 100 mm and tall components of heights up to 28 mm.
I-Pulse S20 : flexible and modular pick & place machine
Flexible and modular pick and place for SMD and Hybrid application (3D MID).
The machine is able to place SMD component from 0201mm up to 120x90mm and with a capacity of 180 feeders makes the equipment flexible and reliable.
The pick & place is able to produce board length up to 1830mm. We have the possibiliy to install a dispense head as option.
The equipment S20 has the capacity to make 3D MID (Dispense solder paste + Mounting device SMD).
Ysi V : inspection machine AOI 3D
Automatic optical inspection AOI in 3D.
Équipement compact et rapide pour le contrôle optique 2D et 3D de vos cartes électroniques.
Fast and compact equipment to control in 2D and 3D you electronic PCB's.
The YSi-V has a high resolution up to 7 microns combined with high colored 12Mp.
The complete visual system consists in 4 angular camera + 1 vertical Camera. The machine YSi-V has the possibility to have a closed loop system with Yamaha Pick and Place machine (See QA-Option).